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Fabrication of Si-based three-dimensional microbatteries: A review
Chuang YUE, Jing LI, Liwei LIN
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 459-476 doi: 10.1007/s11465-017-0462-x
High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.
Keywords: three-dimensional (3D) wafer-scale Si-based anode micro-LIBs thin-film deposition
Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells
Frontiers in Energy 2017, Volume 11, Issue 1, Pages 1-3 doi: 10.1007/s11708-016-0436-4
Patterned wafer bonding using ultraviolet adhesive
Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI
Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2, Pages 214-218 doi: 10.1007/s11465-011-0130-5
The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturePatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic
Keywords: ultraviolet (UV) adhesive intermediate layer patterned wafer bonding
Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3, Pages 559-569 doi: 10.1007/s11465-020-0624-0
Keywords: taping silicon wafer backgrinding subsurface damage surface roughness
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.
Keywords: thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
Structure controlling and process scale-up in the fabrication of nanomaterials
Chunzhong LI,
Frontiers of Chemical Science and Engineering 2010, Volume 4, Issue 1, Pages 18-25 doi: 10.1007/s11705-009-0305-3
Keywords: scale-up significant commercial electroanalytical engineering laboratory
Large-scale App privacy governance
Frontiers of Engineering Management Pages 640-652 doi: 10.1007/s42524-022-0228-y
Keywords: privacy risk Privacy Level quantification large-scale App governance
On the added value of multi-scale modeling of concrete
Frontiers of Structural and Civil Engineering 2022, Volume 16, Issue 1, Pages 1-23 doi: 10.1007/s11709-021-0790-0
Keywords: experiments multi-scale analysis conventional structural analysis concrete reinforced concrete
Large Scale Infrastructure Projects: The Art of Project or Change Management?
Geert Letens,Kurt Verweire,Peter De Prins
Frontiers of Engineering Management 2016, Volume 3, Issue 3, Pages 197-202 doi: 10.15302/J-FEM-2016033
Keywords: large scale project management organization development and change batteries of change model
Large-scale model test study on the water pressure resistance of construction joints of karst tunnel
Frontiers of Structural and Civil Engineering Pages 1249-1263 doi: 10.1007/s11709-023-0974-x
Keywords: karst tunnel lining construction joint water pressure resistance large-scale model test numerical
Zilian QU,Yonggang MENG,Qian ZHAO
Frontiers of Mechanical Engineering 2015, Volume 10, Issue 1, Pages 1-6 doi: 10.1007/s11465-015-0325-2
This paper proposes a new eddy current method, named equivalent unit method (EUM), for the thickness measurement of the top copper film of multilayer interconnects in the chemical mechanical polishing (CMP) process, which is an important step in the integrated circuit (IC) manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measurement of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.
Keywords: CMP eddy current multilayer wafer Cu interconnects equivalent unit
Stabilization treatment of contaminated soil: a field-scale application in Shanghai, China
Changbo ZHANG, Qishi LUO, Chunnu GENG, Zhongyuan LI
Frontiers of Environmental Science & Engineering 2010, Volume 4, Issue 4, Pages 395-404 doi: 10.1007/s11783-010-0271-5
Keywords: stabilization contaminated soil field-scale demonstration technical obstacles
Progress and Prospect of Semiconductor Silicon Wafers in China
Zhang Guohu, Xiao Qinghua, Ma Fei
Strategic Study of CAE 2023, Volume 25, Issue 1, Pages 68-78 doi: 10.15302/J-SSCAE-2023.01.002
Keywords: semiconductor silicon wafer 8 inches 12 inches industry synergy advanced processing
Investigation on the integral output power model of a large-scale wind farm
BAO Nengsheng, MA Xiuqian, NI Weidou
Frontiers in Energy 2007, Volume 1, Issue 1, Pages 67-78 doi: 10.1007/s11708-007-0006-x
Keywords: power model actual energy large-scale practical measurement
Large-scale liquefied natural gas ships
Danping LOU, Yan LI
Frontiers of Engineering Management 2020, Volume 7, Issue 3, Pages 461-465 doi: 10.1007/s42524-019-0090-8
Title Author Date Type Operation
Fabrication of Si-based three-dimensional microbatteries: A review
Chuang YUE, Jing LI, Liwei LIN
Journal Article
Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells
Journal Article
Patterned wafer bonding using ultraviolet adhesive
Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI
Journal Article
Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
Journal Article
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Journal Article
Structure controlling and process scale-up in the fabrication of nanomaterials
Chunzhong LI,
Journal Article
Large Scale Infrastructure Projects: The Art of Project or Change Management?
Geert Letens,Kurt Verweire,Peter De Prins
Journal Article
Large-scale model test study on the water pressure resistance of construction joints of karst tunnel
Journal Article
Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process
Zilian QU,Yonggang MENG,Qian ZHAO
Journal Article
Stabilization treatment of contaminated soil: a field-scale application in Shanghai, China
Changbo ZHANG, Qishi LUO, Chunnu GENG, Zhongyuan LI
Journal Article
Progress and Prospect of Semiconductor Silicon Wafers in China
Zhang Guohu, Xiao Qinghua, Ma Fei
Journal Article
Investigation on the integral output power model of a large-scale wind farm
BAO Nengsheng, MA Xiuqian, NI Weidou
Journal Article