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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

《机械工程前沿（英文）》 2017年第12卷第4期页码 581-590 doi: 10.1007/s11465-017-0454-x

摘要：

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

关键词： electric field microsensor three-dimensional single-chip in-plane rotation

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基于集成液体交换的微流控芯片的完整单细胞动态变形测量 Article

Xu Du, Di Chang, Shingo Kaneko, Hisataka Maruyama, Hirotaka Sugiura, Masaru Tsujii, Nobuyuki Uozumi, Fumihito Arai

《工程（英文）》 2023年第24卷第5期页码 94-101 doi: 10.1016/j.eng.2022.08.020

摘要：

本文报道了采用一种集成了力感应和液体交换功能的微流控芯片来测量单细胞力学性能的方法。使用光学镊子操纵和定位在推力探针和力传感器探针之间的单个细胞。这两个芯片上的探针被设计用来捕获和使细胞变形。通过移动由外力驱动的推力探针，而使单个细胞变形。层流在探针之间形成液-液界面以改变细胞外环境。通过控制注入压力来改变界面的位置。通过调整两个正压力和一个负压力来平衡流动的扩散和扰动。在微流控芯片中测定了不同渗透浓度环境下的单个集胞藻（Synechocystis）菌株PCC 6803 的力学性能。在0.3~0.7 s 内实现液体交换过程，同时也显示了单个细胞的动态变形。可以在30 s 内收集不同渗透浓度下两个杨氏模量值的测量结果以及单个细胞在渗透压冲击下的动态响应。研究了野生型（WT）和突变型集胞藻细胞的动态变形，揭示了机械敏感（MS）通道的功能机制。该系统提供了一种监测单个完整细胞响应快速外部渗透变化的实时力学动力学的新方法；因此，该系统为准确描述细胞中MS通道的生理功能提供了新的机会。

关键词：微流控芯片力学性能动态变形单细胞液体交换

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Molecular dynamics modeling of a single diamond abrasive grain in grinding

Angelos P. MARKOPOULOS,Ioannis K. SAVVOPOULOS,Nikolaos E. KARKALOS,Dimitrios E. MANOLAKOS

《机械工程前沿（英文）》 2015年第10卷第2期页码 168-175 doi: 10.1007/s11465-015-0337-y

摘要：

In this paper the nano-metric simulation of grinding of copper with diamond abrasive grains, using the molecular dynamics (MD) method, is considered. An MD model of nano-scale grinding, where a single diamond abrasive grain performs cutting of a copper workpiece, is presented. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. In the proposed model, the abrasive grain follows a curved path with decreasing depth of cut within the workpiece to simulate the actual material removal process. Three different initial depths of cut, namely 4 ?, 8 ? and 12 ?, are tested, and the influence of the depth of cut on chip formation, cutting forces and workpiece temperatures are thoroughly investigated. The simulation results indicate that with the increase of the initial depth of cut, average cutting forces also increase and therefore the temperatures on the machined surface and within the workpiece increase as well. Furthermore, the effects of the different values of the simulation variables on the chip formation mechanism are studied and discussed. With the appropriate modifications, the proposed model can be used for the simulation of various nano-machining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.

关键词： molecular dynamics abrasive process chip formation cutting force temperature

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

《机械工程前沿（英文）》 2012年第7卷第1期页码 29-37 doi: 10.1007/s11465-012-0314-7

摘要：

Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.

关键词： flip chip defect detection ultrasonic excitation vibration analysis

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

《机械工程前沿（英文）》 2013年第8卷第2期页码 118-126 doi: 10.1007/s11465-013-0253-y

摘要：

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control parameters need to be well matching with the mechanical system. In practical issues, it is difficult and time-consuming work to get these parameters matched because their selection is strongly depended on individuals. In current work, an integrated optimization method was carried out to solve this problem, in which the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain model of transfer system performed on Dymola platform. Based on this model, the searching area of the key control parameters was narrowed by performing integrated optimization. After that a group of parameters were selected from this narrowed area to perform the equipment’s controls. The result showed this method possesses a simple and reliable nature. The optimal solutions also indicated that the optimized control parameters can well satisfy the requirements of transfer system. On the other hand, it greatly reduced the engineering adjustment time by using this method.

关键词： LED chip sorter multi-domain modeling and simulation parameter optimization modelica language

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 472-472 doi: 10.1007/s11465-009-0077-y

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

《农业科学与工程前沿（英文）》 2023年第10卷第3期页码 448-457 doi: 10.15302/J-FASE-2023490

摘要：

● Low-value biowaste including wood chip and potato peel was valorized to syngas.

关键词： Aspen Plus co-gasification potato peel syngas simulation waste reduction wood chip

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3D finite element prediction of chip flow, burr formation, and cutting forces in micro end-milling of

A. DAVOUDINEJAD, P. PARENTI, M. ANNONI

《机械工程前沿（英文）》 2017年第12卷第2期页码 203-214 doi: 10.1007/s11465-017-0421-6

摘要：

Predictive models for machining operations have been significantly improved through numerous methods in recent decades. This study proposed a 3D finite element modeling (3D FEM) approach for the micro end-milling of Al6061-T6. Finite element (FE) simulations were performed under different cutting conditions to obtain realistic numerical predictions of chip flow, burr formation, and cutting forces. FE modeling displayed notable advantages, such as capability to easily handle any type of tool geometry and any side effect on chip formation, including thermal aspect and material property changes. The proposed 3D FE model considers the effects of mill helix angle and cutting edge radius on the chip. The prediction capability of the FE model was validated by comparing numerical model and experimental test results. Burr dimension trends were correlated with force profile shapes. However, the FE predictions overestimated the real force magnitude. This overestimation indicates that the model requires further development.

关键词： 3D finite element modeling micro end-milling cutting force chip formation burr formation

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用于器官芯片的工程化血管系统 Review

Abdellah Aazmi, 周竑钊, 李雨亭, 俞梦飞, 许晓斌, 吴钰桐, 马梁, 张斌, 杨华勇

《工程（英文）》 2022年第9卷第2期页码 131-147 doi: 10.1016/j.eng.2021.06.020

摘要：

器官芯片技术是一种很有前途的三维（3D）动态培养方法，可确保准确高效的细胞培养，在临床前试验中具有替代动物模型的巨大潜力。血管系统是人体内最丰富的器官，在氧气交换和物质传递中起着至关重要的作用，是组织器官生存的决定性因素。因此，必须将血管系统集成到器官芯片中，以重建组织和器官微环境及其生理功能。本文讨论了血管与新兴器官芯片技术之间的协同作用，为复现生理学和疾病特征提供了更好的可能性。此外，回顾了血管化的器官芯片制造过程的不同步骤，包括使用不同生物制造策略的结构制造和组织构建。最后，概述了这项技术在器官和肿瘤培养这个有极具吸引力且快速发展的领域的适用性。

关键词：器官芯片血管生物打印肿瘤芯片

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三维芯片成像

Marcus Woo

《工程（英文）》 2020年第6卷第5期页码 485-486 doi: 10.1016/j.eng.2020.03.009

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Development of electrorheological chip and conducting polymer-based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

《机械工程前沿（英文）》 2009年第4卷第4期页码 393-396 doi: 10.1007/s11465-009-0043-8

摘要： This paper presents the development of an integrated sensor using two types of smart materials: electrorheological (ER) fluids and conducting polymers (CPs). The developed ER chip worked as an actuator, and it was driven by different voltages and control frequencies. When the four electrodes are controlled synchronously, the diaphragm acts as a vibrator whose frequency can be adjusted in accordance with the frequency of the electrical signals. The response signals of the CP sensor were recorded, and its properties were analyzed. Experimental results show that the amplitude decreases monotonically when the frequency increases, owing to the time delay in the pressure buildup in the ER chip. However, the displacement fluctuation of the diaphragm below 20Hz can be detected clearly even if the value is very low. When the vibration frequency is larger than 20Hz, the CP sensor can hardly detect the displacement fluctuation. Thus, the upper limit frequency that the CP sensor can detect is about 20Hz. The practical applications of this microdevice are also discussed.

关键词： electrorheological (ER) fluids conducting polymer (CP) polydimethylsioxane (PDMS) driving frequency amplitude bubble counter

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机器学习推动人类芯片设计

Robert Pollie

《工程（英文）》 2022年第10卷第3期页码 7-9 doi: 10.1016/j.eng.2022.01.006

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分析芯片微通道制作技术进展

魏守水,张玉林,崔大付

《中国工程科学》 2004年第6卷第10期页码 90-94

摘要：

微通道制作是微分析芯片制作中的关键技术之一。就选取材料的原则，模板复制中的模具制造技术及微通道直接加工方法做了比较，提出了微流体芯片产业化的可行性方案。

关键词：分析芯片微细加工 μ-TAS

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Biological chip technology to quickly batch select optimum cryopreservation procedure

YU Lina, LIU Jing, ZHOU Yixin, HUA Zezhao

《能源前沿（英文）》 2007年第1卷第3期页码 316-321 doi: 10.1007/s11708-007-0046-2

摘要： In the practices of cryobiology, selection of an optimum freeze/thawing program and an idealistic cryoprotective agent often requires rather tedious, time consuming and repetitive tests. Integrating the functions of sample preparation and viability detection, the concept of biochip technology was introduced to the field of cryopreservation, aiming at quickly finding an optimum freezing and thawing program. Prototype devices were fabricated and corresponding experimental tests were performed. It was shown that microflow-channel chip could not offer a high quality solution distribution. As an alternative, the spot-dropping chip proved to be an excellent way to load the sample quickly and reliably. Infrared thermal mapping on such a chip showed that it had a rather uniform heat transfer boundary. Applying the spot-dropping chip combined with the thermoelectric cooling device, the final output of cryopreservation of multiple samples was tested, and the optimal freeze/thawing program as well as the potentially best concentration of the cryoprotective agent was found by analyzing the results. Further, application of this technique to measure the thermo-physical properties of the cryo-protective agent was also investigated. The study demonstrated that a biochip with integrated automatic loading and inspection units opens the possibility of a massive optimization of the complex cryopreservation program in a quicker and more economical way.

关键词： idealistic cryoprotective concentration Prototype technology alternative

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Crystallographic orientation effect on cutting-based single atomic layer removal

Wenkun XIE, Fengzhou FANG

《机械工程前沿（英文）》 2020年第15卷第4期页码 631-644 doi: 10.1007/s11465-020-0599-x

摘要： The ever-increasing requirements for the scalable manufacturing of atomic-scale devices emphasize the significance of developing atomic-scale manufacturing technology. The mechanism of a single atomic layer removal in cutting is the key basic theoretical foundation for atomic-scale mechanical cutting. Material anisotropy is among the key decisive factors that could not be neglected in cutting at such a scale. In the present study, the crystallographic orientation effect on the cutting-based single atomic layer removal of monocrystalline copper is investigated by molecular dynamics simulation. When undeformed chip thickness is in the atomic scale, two kinds of single atomic layer removal mechanisms exist in cutting-based single atomic layer removal, namely, dislocation motion and extrusion, due to the differing atomic structures on different crystallographic planes. On close-packed crystallographic plane, the material removal is dominated by the shear stress-driven dislocation motion, whereas on non-close packed crystallographic planes, extrusion-dominated material removal dominates. To obtain an atomic, defect-free processed surface, the cutting needs to be conducted on the close-packed crystallographic planes of monocrystalline copper.

关键词： ACSM single atomic layer removal mechanism crystallographic orientation effect mechanical cutting Manufacturing III