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纳米加工 2

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原子力显微镜 1

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A review of the scalable nano-manufacturing technology for flexible devices

Wenbin HUANG,Xingtao YU,Yanhua LIU,Wen QIAO,Linsen CHEN

《机械工程前沿（英文）》 2017年第12卷第1期页码 99-109 doi: 10.1007/s11465-017-0416-3

摘要：

Recent advances in electronic and photonic devices, such as artificial skin, wearable systems, organic and inorganic light-emitting diodes, have gained considerable commercial and scientific interest in the academe and in industries. However, low-cost and high-throughput nano-manufacturing is difficult to realize with the use of traditional photolithographic processes. In this review, we summarize the status and the limitations of current nano-patterning techniques for scalable and flexible functional devices in terms of working principle, resolution, and processing speed. Finally, several remaining unsolved problems in nano-manufacturing are discussed, and future research directions are highlighted.

关键词： flexible nano-manufacturing flexible devices nanofabrication scalability

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A non-lithographic plasma nanoassembly technology for polymeric nanodot and silicon nanopillar fabrication

Athanasios Smyrnakis, Angelos Zeniou, Kamil Awsiuk, Vassilios Constantoudis, Evangelos Gogolides

《化学科学与工程前沿（英文）》 2019年第13卷第3期页码 475-484 doi: 10.1007/s11705-019-1809-0

摘要： In this work, we present plasma etching alone as a directed assembly method to both create the nanodot pattern on an etched polymeric (PMMA) film and transfer it to a silicon substrate for the fabrication of silicon nanopillars or cone-like nanostructuring. By using a shield to control sputtering from inside the plasma reactor, the size and shape of the resulting nanodots can be better controlled by varying plasma parameters as the bias power. The effect of the shield on inhibitor deposition on the etched surfaces was investigated by time-of-flight secondary ion mass spectroscopy (ToF-SIMS) measurements. The fabrication of quasi-ordered PMMA nanodots of a diameter of 25 nm and period of 54 nm is demonstrated. Pattern transfer to the silicon substrate using the same plasma reactor was performed in two ways: (a) a mixed fluorine-fluorocarbon-oxygen nanoscale etch plasma process was employed to fabricate silicon nanopillars with a diameter of 25 nm and an aspect ratio of 5.6, which show the same periodicity as the nanodot pattern, and (b) high etch rate cryogenic plasma process was used for pattern transfer. The result is the nanostructuring of Si by high aspect ratio nanotip or nanocone-like features that show excellent antireflective properties.

关键词： plasma nanoassembly etching nanodots nanopillars nanofabrication

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蘸水笔刻蚀技术（DPN）的机理与进展

蒋洪奎,姚汤伟,胡礼广,沈亚强,虞献文

《中国工程科学》 2008年第10卷第7期页码 173-179

摘要：

蘸水笔刻蚀（dip-pen nanolithography ，DPN）技术是近年来发展起来的基于原子力显微镜（AFM）的一种扫描探针加工技术，有着广泛的应用前景。蘸水笔技术的刻蚀过程包括AFM 针尖对墨水分子的吸附、针尖与基底间弯月液桥的形成、墨水分子在液桥中的传输、墨水分子在基底的扩散等四个阶段，并受温度、湿度、针尖、扫描速度等多种因素的影响。文章具体分析了蘸水笔技术在不同阶段的作用机理，综合介绍了蘸水笔刻蚀技术在近年来的进展，包括电化学DPN 技术、DPN 的多种加工模式、DPN 的复合加工及多探针的DPN 加工等；分析了DPN的加工特点及其应用。

关键词：蘸水笔纳米刻蚀原子力显微镜纳米加工

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基于超构表面等离激元透镜的高速并行近场直写纳米光刻系统 Article

胡跃强, 李苓, 王榕, 宋剑, 王鸿栋, 段辉高, 纪佳馨, 孟永钢

《工程（英文）》 2021年第7卷第11期页码 1623-1630 doi: 10.1016/j.eng.2020.08.019

摘要：

具有简单、高效、低成本和高灵活性等特点的纳米加工技术在纳米尺度基础研究和原型验证中不可或缺。研究已证明，采用表面等离激元的近场光刻技术（即等离激元光刻）是一种有前景的解决方案。基于高速旋转基底上高刚度被动纳米间隙控制的加工系统是其中一种高效率加工方案。但是，为了研发出新一代具有高分辨率且可靠高效的纳米加工技术，需要探索一种更小更稳定的纳米间隙和新型等离激元透镜及其并行加工方案。因此，本文设计了一套并行等离激元直写纳米光刻系统。该系统应用了新型等离子浮动磁头，当转速为8~18 m⋅s⁻¹时，其最小飞行高度可实现15 nm并且具有高平行度。本文还研制了一种多级的基于超构表面的偏振不敏感等离激元透镜。与传统的等离激元透镜相比，该透镜耦合的功率更大，焦点的范围更集中。该原型系统实现了约26 nm最小线宽的纳米结构并行光刻。该系统有望应用于高自由级、低成本的纳米加工技术，如平面光学元件和纳米机电系统。

关键词：纳米加工表面等离激元光刻等离子体飞行头超构表面