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利用微机电系统技术制作弯曲结构表面无线无源柔性加速度计 Research Article

李晨1,2,贾蔓谷1,洪应平2,薛亚楠2,熊继军2

《信息与电子工程前沿（英文）》 2022年第23卷第5期页码 801-809 doi: 10.1631/FITEE.2100236

摘要：该加速度计由柔性聚酰亚胺（PI）衬底和平面螺旋电感（厚度为300 nm）组成，采用微机电系统（MEMS）技术，可任意弯曲或折叠，可牢固地粘附在具有弯曲结构的物体表面。

关键词：弯曲结构表面；柔性加速度计；微机电系统（MEMS）技术；无线非接触式测量

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中国仪器仪表工程科技2035发展趋势研究

王雪,张莉

《中国工程科学》 2017年第19卷第1期页码 103-107 doi: 10.15302/J-SSCAE-2017.01.015

摘要：本文分析了仪器仪表领域2035年的发展目标，围绕新型仪器仪表的数字化、智能化、网络化的发展趋势，从智能仪器仪表、医疗仪器和微机电系统（MEMS）三个领域阐述了未来我国仪器仪表工程科技领域的发展方向及关键技术

关键词：仪器仪表智能仪器仪表医疗仪器微机电系统趋势分析

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蒸汽压力和超疏水纳米复合涂层对微电子器件可靠性的影响 Article

樊学军,陈良彪,汪正平,Hsing-Wei Chu,张国旗

《工程（英文）》 2015年第1卷第3期页码 384-390 doi: 10.15302/J-ENG-2015034

摘要：

由于高蒸汽压力可能导致微电子器件在高温和高湿度环境中失效，蒸汽压力的描述和模拟对研究微电子器件的湿度可靠性至关重要。为了最大程度地减小湿度的影响，可以在器件外表面涂抹一层超疏水涂层，以防止水分渗入。但是，超疏水涂层提高微电子器件可靠性的具体机制目前仍没有完全被理解。本文首先介绍了微电子高分子材料蒸汽压力的现有的一些理论。笔者还根据实验结果论述了超疏水涂层在防止水蒸气进入器件方面的机制和有效性。本文重点讨论了两个理论模型：基于微观力学的全场蒸汽压力模型和对流扩散模型。这两种方法都已成功用于说明无涂层样本的实验结果。但是，当器件上涂有超疏水纳米复合涂层时，笔者仍发现器件质量增加，其原因很可能是水蒸气可以透过超疏水涂层渗入。这种现象导致人们对超疏水涂层的有效性产生怀疑。根据理论和实验结果，笔者认为需要提出一种新的理论来理解水蒸气如何渗透超疏水涂层。

关键词：蒸汽压力湿度半导体可靠性微机电系统(MEMS) 超疏水纳米复合涂层

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硅微z轴谐振陀螺仪负电刚度效应分析及实验验证

夏敦柱,周百令,王寿荣

《中国工程科学》 2007年第9卷第8期页码 66-68

摘要：

介绍了在开环工作状态下硅微z轴谐振陀螺仪由于加工工艺缺陷所导致的误差机理。为减小陀螺仪初始电容差和抑制正交耦合误差，提出了一种闭环控制检测策略。重点分析了其力矩反馈器的电刚度效应并给出其线性数学模型表示式。通过对硅微z轴陀螺仪敏感模态的反馈力与谐振频率的关系分析，间接得出了在敏感方向上电负刚度与力矩器所施电压的内在联系，并在实验上进一步验证电刚度效应。这将为下一步闭环控制方案的设计奠定重要基础。

关键词：硅微z轴陀螺仪负电刚度力矩反馈器微机电系统

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机械与运载工程领域颠覆性技术战略研究

杨艳明,赵云,邵珠峰,李道春,高增桂,张子龙,沈悦,王林军

《中国工程科学》 2018年第20卷第6期页码 27-33 doi: 10.15302/J-SSCAE-2018.06.005

摘要： style="text-align: justify;">通过文献研究和专家访谈等方法，提出机械与运载工程领域已有或潜在的颠覆性技术：仿生智能技术、无轴轮缘推进技术、智能无人飞行器技术、超回路列车技术和微机电系统

关键词：机械与运载工程颠覆性技术仿生智能技术无轴轮缘推进技术智能无人飞行器技术超回路列车技术微机电系统

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基于自解耦三明治结构的横向运动栅场效应晶体管微机电系统微力传感器 Article

高文迪, 乔智霞, 韩香广, 王小章, Adnan Shakoor, 刘存朗, 卢德江, 杨萍, 赵立波, 王永录, 王久洪, 蒋庄德, 孙东

《工程（英文）》 2023年第21卷第2期页码 61-74 doi: 10.1016/j.eng.2022.06.018

摘要：

本文介绍了一种基于横向运动栅极场效应晶体管（LMGFET）的新型微型力传感器。文中提出了一种用于小型LMGFET器件性能评估的电气模型，与以前的模型相比，其具有更高精度。由此设计了一种新型的三明治夹层结构，该结构由跨轴解耦Au-栅极阵列层和两个柔性光刻胶SU-8 层组成。通过所提出的双差分传感布置，LMGFET工作时受垂直干扰产生的输出电流被大大消除，所提出传感器的相对输出误差从4.53%（传统差分结构）降低到0.01%。本文还为所提出的传感器开发和模拟了一个可行的制造工艺过程。基于LMGFET的力传感器的灵敏度为4.65 μA∙nN−1，可与垂直可动栅极场效应晶体管（VMGFET）器件相媲美，器件的非线性度提高了0.78%，测量范围扩大为±5.10 μN。上述分析能够为LMGFET器件的电气和结构参数提供全面的设计优化指导，并证明了所提出的传感器在生物医学显微操作应用中具有出色的力传感潜力。

关键词：微力传感器横向运动栅极场效应管柔性光刻胶SU-8 生物医学显微操作

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微系统研究的思考和单芯片RF-MEMS研究进展

钟先信,余文革,李晓毅,巫正中,刘积学,陈帅,邵小良

《中国工程科学》 2004年第6卷第7期页码 21-25

摘要：

微光机电一体化系统简称微系统，是当今技术发展的前沿领域之一。微系统技术的发展将大大地促进许多产品或装置微型化、集成化和智能化，成倍地提高器件和系统的功能密度、信息密度与互连密度，大幅度地节能降耗，有广阔的应用领域和市场。文章阐述了微系统研究的意义以及微系统基础研究的重要性，概述了用于无线通信设备的MEMS器件的性能，指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一，介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况

关键词：微系统集成单芯片无线通信系统

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Special issue: Micro-electromechanical systems (MEMS)

Zhuangde JIANG

《机械工程前沿（英文）》 2017年第12卷第4期页码 457-458 doi: 10.1007/s11465-017-0492-4

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Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH

《机械工程前沿（英文）》 2017年第12卷第4期页码 490-509 doi: 10.1007/s11465-017-0484-4

摘要：

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the . The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

关键词： direct-write additive manufacturing microfabrication MEMS

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混合动力挖掘机电动回转系统通信错误状态下的分布式容错策略 Article

Da-hui GAO, Qing-feng WANG, Yong LEI

《信息与电子工程前沿（英文）》 2017年第18卷第7期页码 941-954 doi: 10.1631/FITEE.1601021

摘要：基于自适应的延时与丢帧补偿，提出了一种分布式容错策略，用以确保基于CAN （controller area network）总线的混合动力挖掘机电动回转系统在通信出错时获得良好的运行性能。仿真和实验结果表明提出的容错策略可以有效第减小通信错误引起的系统超调和响应时间变化。

关键词：容错；延时补偿；CAN总线；通信错误；混合动力挖掘机电动回转系统

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Review of MEMS differential scanning calorimetry for biomolecular study

Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO

《机械工程前沿（英文）》 2017年第12卷第4期页码 526-538 doi: 10.1007/s11465-017-0451-0

摘要：

Differential scanning calorimetry (DSC) is one of the few techniques that allow direct determination of enthalpy values for binding reactions and conformational transitions in biomolecules. It provides the thermodynamics information of the biomolecules which consists of Gibbs free energy, enthalpy and entropy in a straightforward manner that enables deep understanding of the structure function relationship in biomolecules such as the folding/unfolding of protein and DNA, and ligand bindings. This review provides an up to date overview of the applications of DSC in biomolecular study such as the bovine serum albumin denaturation study, the relationship between the melting point of lysozyme and the scanning rate. We also introduce the recent advances of the development of micro-electro-mechanic-system (MEMS) based DSCs.

关键词： differential scanning calorimetry biomolecule MEMS thermodynamic

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机电装备的失效分析、安全评定和无损检测

钟群鹏,武淮生,张峥,田永江

《中国工程科学》 1999年第1卷第1期页码 43-48

摘要：

从认识论的高度阐明失效、失效分析和预防在人类科学技术发展中的属性、地位和作用。失效分析和预防具有多学科交叉综合的属性，它的发展依赖于应用学科、应用基础学科、甚至于基础学科的发展，但又对它们的发展起重要反转作用和影响。因此，它是科学技术第一生产力中最积极、最活跃的因素之一。从方法论的角度进一步叙述了失效分析与失效预防之间的辩证关系。失效分析是一种事后的逆向思维过程，它是从异常现象（结果）到因素（模式、原因和机理）的反向科技探索，而失效预防（安全评定）则是从因素到结果的一种事先的正向思维过程。逆向思维与正向思维协同并用，事后分析转化为事先分析，构成科学技术研究活动和科技发展的全过程，两者不可偏废。综述了失效分析和失效预防（安全评定）的主要内容、技术、方法和它们的发展趋势，并提出它们与无损检测技术之间的关系。

关键词：机电装备失效分析安全评定无损检测

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用于微电子机械系统封装的体硅键合技术和薄膜密封技术

王渭源,王跃林

《中国工程科学》 2002年第4卷第6期页码 56-62

摘要：

对静电键合、体硅直接键合和界面层辅助键合等三种体硅键合技术，整片操作、局部操作和选择保护等三种密封技术，以及这些技术用于微电子机械系统的密封作了评述，强调在器件研究开始时应考虑封装问题，具体技术则应在保证器件功能和尽量减少芯片复杂性两者之间权衡决定

关键词：体硅键合技术薄膜密封技术微电子机械系统封装技术

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

《机械工程前沿（英文）》 2017年第12卷第4期页码 557-566 doi: 10.1007/s11465-017-0441-2

摘要：

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关键词： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow

《机械工程前沿（英文）》 2023年第18卷第2期 doi: 10.1007/s11465-023-0747-1

摘要： Capacitive sensors are efficient tools for biophysical force measurement, which is essential for the exploration of cellular behavior. However, attention has been rarely given on the influences of external mechanical and internal electrical interferences on capacitive sensors. In this work, a bionic swallow structure design norm was developed for mechanical decoupling, and the influences of structural parameters on mechanical behavior were fully analyzed and optimized. A bionic feather comb distribution strategy and a portable readout circuit were proposed for eliminating electrostatic interferences. Electrostatic instability was evaluated, and electrostatic decoupling performance was verified on the basis of a novel measurement method utilizing four complementary comb arrays and application-specific integrated circuit readouts. An electrostatic pulling experiment showed that the bionic swallow structure hardly moved by 0.770 nm, and the measurement error was less than 0.009% for the area-variant sensor and 1.118% for the gap-variant sensor, which can be easily compensated in readouts. The proposed sensor also exhibited high resistance against electrostatic rotation, and the resulting measurement error dropped below 0.751%. The rotation interferences were less than 0.330 nm and (1.829 × 10⁻⁷)°, which were 35 times smaller than those of the traditional differential one. Based on the proposed bionic decoupling method, the fabricated sensor exhibited overwhelming capacitive sensitivity values of 7.078 and 1.473 pF/µm for gap-variant and area-variant devices, respectively, which were the highest among the current devices. High immunity to mechanical disturbances was maintained simultaneously, i.e., less than 0.369% and 0.058% of the sensor outputs for the gap-variant and area-variant devices, respectively, indicating its great performance improvements over existing devices and feasibility in ultralow biomedical force measurement.

关键词： micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement